Display apparatus and method of manufacturing the same

ABSTRACT

A display apparatus and a method of manufacturing the same. The display apparatus includes a circuit board; and a plurality of pixels formed on the circuit board, wherein at least one of a blue light emitting diode chip, a red light emitting diode part, and a green light emitting diode chip is disposed in each of the pixels, and the blue light emitting diode chip, the red light emitting diode part and the green light emitting diode chip are covered by a coupling structure.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority from and the benefit of U.S.Provisional Patent Application No. 62/473,791, filed on Mar. 20, 2017;U.S. Provisional Patent Application No. 62/462,567, filed on Feb. 23,2017; and U.S. Provisional Patent Application No. 62/458,100, filed onFeb. 13, 2017, all of which are incorporated by reference for allpurposes as if fully set forth herein.

BACKGROUND Field

Exemplary embodiments of the present invention relate to a displayapparatus and a method of manufacturing the same, and, moreparticularly, to a display apparatus employing a light emitting diodepackage having a large size as compared with a light emitting diodechip, and a method of manufacturing the same.

Discussion of the Background

A light emitting diode refers to an inorganic semiconductor device thatemits light through recombination of electrons and holes. In recentyears, light emitting diodes have been used in various fields includingdisplays, automobile lamps, general lighting, and the like. Lightemitting diodes have various advantages, such as long lifespan, lowpower consumption, and rapid response. Thus, a light emitting deviceusing a light emitting diode can be used as a light source in variousfields.

Recently, display apparatuses, such as TVs, monitors or electronicdisplay boards, realize colors through a thin film transistor liquidcrystal display (TFT-LCD) panel, and employ light emitting diodes as alight source of a backlight unit for emission of the realized colors. Inaddition, various studies have been conducted to develop a displayapparatus capable of realizing colors through light emitting diodesinstead of using a separate LCD.

In order to use light emitting diodes as a light source of a backlightunit or for direct realization of colors, one light emitting diode maybe provided for each pixel. Here, in order to control each of the lightemitting diodes, an active matrix (AM) drive type or a passive matrix(PM) drive type may be employed. For the AM drive type, the luminousarea of each light emitting diode is 1/10,000 of the area of one pixel,and for the PM drive type, the luminous area of each light emittingdiode is 1/100 of the area of one pixel.

However, light emitting diodes having an excessively large luminous areahave a problem of low current density, causing deterioration in luminousefficacy. On the contrary, light emitting diodes having a small luminousarea provide difficulty in mounting and replacement of a number of lightemitting diodes due to a small size thereof.

The above information disclosed in this Background section is only forunderstanding of the background of the inventive concepts, and,therefore, it may contain information that does not constitute priorart.

SUMMARY

Exemplary embodiments of the present invention provide a displayapparatus including a light emitting diode package, which employs lightemitting diodes having a small luminous area as compared with the areaof a pixel in order to increase yield in mounting and repair of thelight emitting diodes, and a method of manufacturing the same.

Additional features of the inventive concepts will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the inventive concepts.

In accordance with an exemplary embodiment of the present invention, adisplay apparatus includes: a circuit board; and a plurality of pixelsformed on the circuit board, wherein at least one of a blue lightemitting diode chip, a red light emitting diode part, and a green lightemitting diode chip is disposed in each of the pixels, and the bluelight emitting diode chip, the red light emitting diode part and thegreen light emitting diode chip are covered by a coupling structure.

The display apparatus may further include: a substrate on which the bluelight emitting diode chip, the red light emitting diode part and thegreen light emitting diode chip are disposed; and a plurality of firstsubstrate electrodes and a plurality of second substrate electrodesdisposed on the substrate and each electrically connected to each of theblue light emitting diode chip, the red light emitting diode part andthe green light emitting diode chip, the plurality of first substrateelectrodes and the plurality of second substrate electrodes beingelectrically insulated from each other, wherein the coupling structureis disposed on the substrate.

The red light emitting diode part may be a red light emitting diodechip.

The red light emitting diode part may include: a blue light emittingdiode chip or a UV light emitting diode chip disposed on the substrate;an insulating portion covering the blue or UV light emitting diode chipand containing at least one type of phosphor emitting red light throughwavelength conversion of light emitted from the blue light emittingdiode chip or the UV light emitting diode chip; and a color filterblocking blue light or UV light among light discharged through theinsulating portion.

Each of the first substrate electrodes and each of the plural secondsubstrate electrodes may be disposed on upper and lower surfaces of thesubstrate through via-holes formed in the substrate.

The first substrate electrodes and the plural second substrateelectrodes are electrically connected to the circuit board.

The circuit board may have a circuit configured to allow the firstsubstrate electrodes to be electrically connected as individualelectrodes to the blue light emitting diode chip, the red light emittingdiode part and the green light emitting diode chip, respectively, and toallow the second substrate electrodes to be electrically connected ascommon electrodes to the blue light emitting diode chip, the red lightemitting diode part and the green light emitting diode chip,respectively.

The display apparatus may further include a reflective portion disposedto surround a side surface of the coupling structure and reflectinglight emitted through the coupling structure.

At least one of the blue light emitting diode chip and the green lightemitting diode chip may include: a light emitting structure comprising afirst conductivity type semiconductor layer, a second conductivity typesemiconductor layer, and an active layer interposed between the firstand second conductivity type semiconductor layers; and a first electrodeelectrically connected to the first conductivity type semiconductorlayer.

At least one of the blue light emitting diode chip and the green lightemitting diode chip may further include, a second electrode electricallyconnected to the second conductivity type semiconductor layer, the firstand second electrodes may be arranged in one direction of the lightemitting structure, and the first electrode may be electricallyconnected to an exposed region of the first conductivity typesemiconductor layer formed by partially removing the active layer andthe second conductivity type semiconductor layer.

At least one of the blue light emitting diode chip and the green lightemitting diode chip may further include: an encapsulation portiondisposed to cover the first and second electrodes and the light emittingstructure while insulating the first and second electrodes from eachother; a first bump electrically connected to the first electrode; and asecond bump electrically connected to the second electrode, and thefirst and second bumps may be electrically connected to the first andsecond electrodes through the encapsulation portion, respectively.

At least one of the blue light emitting diode chip and the green lightemitting diode chip may have a width smaller than the substrate.

The coupling structure may include at least one of polydimethylsiloxane(PDMS), polyimide, poly(methyl methacrylate) (PMMA), a ceramic material,an epoxy resin, and a synthetic resin.

In accordance with another exemplary embodiment of the presentinvention, a method of manufacturing a display apparatus may include:forming a plurality of light emitting diode chips on a firstmanufacturing substrate; coupling at least some of the light emittingdiode chips to a substrate comprising first and second substrateelectrodes and provided to a second manufacturing substrate, followed byremoving the first manufacturing substrate; forming an insulatingportion to cover the plurality of light emitting diode chips; coupling athird manufacturing substrate to an upper surface of the insulatingportion, followed by removing the second manufacturing substrate;forming a plurality of light emitting diode packages by removing theinsulating portion with reference to the plurality of light emittingdiode chips; and transferring some of the light emitting diode packagesfrom the third manufacturing substrate to a printed circuit board.

Forming the plurality of light emitting diode chips may include: forminga plurality of light emitting structures on the first manufacturingsubstrate, each of the light emitting structures comprising a firstconductivity type semiconductor layer, a second conductivity typesemiconductor layer, and an active layer interposed between the firstand second conductivity type semiconductor layers; forming anencapsulation portion to cover the plurality of light emittingstructures and forming first and second bumps on the encapsulationportion to be electrically connected to the first and secondconductivity type semiconductor layers, respectively; forming a firstmanufacturing insulating portion to cover the encapsulation portion andthe first and second bumps; and exposing the first and second bumpsthrough the encapsulation portion, and coupling at least some of thelight emitting diode chips to the substrate comprises electricallycoupling the first and second bumps to the first and second substrateelectrodes.

The first and second conductivity type semiconductor layers may beexposed in one direction, first and second electrodes are formed on thefirst and second conductivity type semiconductor layers, respectively,and the first and second bumps may be formed to be electricallyconnected to the first and second electrodes through the encapsulationportion, respectively.

In coupling the third manufacturing substrate to the upper surface ofthe insulating portion, at least one buffer layer may be formed betweenthe insulating portion and the third manufacturing substrate.

The insulating portion may include at least one of polydimethylsiloxane(PDMS), polyimide, poly(methyl methacrylate) (PMMA), and a ceramicmaterial.

According to exemplary embodiments, the light emitting diode chip canhave a high current density, despite a small amount of current beingsupplied to the light emitting diode chip through reduction in luminousarea.

In addition, even with the light emitting diode chip having a smallluminous area, the light emitting diode package has a large size ascompared with the light emitting diode chip, thereby improving yield inmanufacture and replacement of a display apparatus for repair.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the inventive concepts, and are incorporated in andconstitute a part of this specification, illustrate exemplaryembodiments of the inventive concepts, and together with the descriptionserve to describe the principles of the inventive concepts.

FIG. 1 is a sectional view of part of a display apparatus according to afirst exemplary embodiment of the present invention.

FIG. 2A, FIG. 2B, FIG. 2C, FIG. 2D, FIG. 2E, FIG. 2F, FIG. 2G, FIG. 2H,FIG. 2I, FIG. 2J, FIG. 2K, and FIG. 2L are sectional views illustratinga method of manufacturing the display apparatus according to the firstexemplary embodiment.

FIG. 3 is a sectional view of part of a display apparatus according to asecond exemplary embodiment of the present invention.

FIG. 4A, FIG. 4B, FIG. 4C, FIG. 4D, FIG. 4E, FIG. 4F, FIG. 4G, FIG. 4H,FIG. 4I, FIG. 4J, FIG. 4K, FIG. 4L, FIG. 4M, FIG. 4N, FIG. 40, FIG. 4P,FIG. 4Q, FIG. 4R, and FIG. 4S are sectional views illustrating a methodof manufacturing the display apparatus according to the second exemplaryembodiment.

FIG. 5 is a sectional view of part of a display apparatus according to athird exemplary embodiment of the present invention.

FIG. 6 is a sectional view of part of a display apparatus according to afourth exemplary embodiment of the present invention.

FIG. 7 is a sectional view of part of a display apparatus according to afifth exemplary embodiment of the present invention.

FIG. 8 is a sectional view of part of a display apparatus according to asixth exemplary embodiment of the present invention.

FIG. 9 is a sectional view of part of a display apparatus according to aseventh exemplary embodiment of the present invention.

FIG. 10 is a sectional view of part of a display apparatus according toan eighth exemplary embodiment of the present invention.

FIG. 11 is a sectional view of part of a display apparatus according toa ninth exemplary embodiment of the present invention.

FIG. 12 is a sectional view of a light emitting diode package accordingto a tenth exemplary embodiment of the present invention.

FIG. 13 is a sectional view of a light emitting diode package accordingto a eleventh exemplary embodiment of the present invention.

FIG. 14 is a sectional view of a light emitting diode package accordingto a twelfth exemplary embodiment of the present invention.

FIG. 15 is a sectional view of a light emitting diode package accordingto a is thirteenth exemplary embodiment of the present invention.

FIG. 16 is a sectional view of a light emitting diode package accordingto a fourteenth exemplary embodiment of the present invention.

FIG. 17 is a sectional view of a light emitting diode package accordingto a fifteenth exemplary embodiment of the present invention

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments of the invention. As usedherein, “embodiments” are non-limiting examples of devices or methodsemploying one or more of the inventive concepts disclosed herein. It isapparent, however, that various exemplary embodiments may be practicedwithout these specific details or with one or more equivalentarrangements. In other instances, well-known structures and devices areshown in block diagram form in order to avoid unnecessarily obscuringvarious exemplary embodiments. Further, various exemplary embodimentsmay be different, but do not have to be exclusive. For example, specificshapes, configurations, and characteristics of an exemplary embodimentmay be used or implemented in another exemplary embodiment withoutdeparting from the inventive concepts.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element or layer, it may bedirectly on, connected to, or coupled to the other element or layer orintervening elements or layers may be present. When, however, an elementor layer is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. To this end, the term“connected” may refer to physical, electrical, and/or fluid connection,with or without intervening elements. Further, the D1-axis, the D2-axis,and the D3-axis are not limited to three axes of a rectangularcoordinate system, such as the x, y, and z—axes, and may be interpretedin a broader sense. For example, the D1-axis, the D2-axis, and theD3-axis may be perpendicular to one another, or may represent differentdirections that are not perpendicular to one another. For the purposesof this disclosure, “at least one of X, Y, and Z” and “at least oneselected from the group consisting of X, Y, and Z” may be construed as Xonly, Y only, Z only, or any combination of two or more of X, Y, and Z,such as, for instance, XYZ, XYY, YZ, and ZZ. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one elements relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exemplaryterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various exemplary embodiments are described herein with reference tosectional and/or exploded illustrations that are schematic illustrationsof idealized exemplary embodiments and/or intermediate structures. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should notnecessarily be construed as limited to the particular illustrated shapesof regions, but are to include deviations in shapes that result from,for instance, manufacturing. In this manner, regions illustrated in thedrawings may be schematic in nature and the shapes of these regions maynot reflect actual shapes of regions of a device and, as such, are notnecessarily intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

Exemplary embodiments of the present invention will be described indetail with reference to the accompanying drawings.

FIG. 1 is a sectional view of part of a display apparatus according to afirst exemplary embodiment.

Referring to FIG. 1, the display apparatus 100 includes a blue lightemitting diode part 102, a red light emitting diode part 104, a greenlight emitting diode part 106, and a printed circuit board 200. In thisway, the blue light emitting diode part 102, the red light emittingdiode part 104, and the green light emitting diode part 106 may beprovided as a group to one pixel of the display apparatus 100.

The blue light emitting diode part 102 employs a blue light emittingdiode chip 122 to discharge blue light emitted from the blue lightemitting diode chip 122 to the outside, and the green light emittingdiode part 106 employs a green light emitting diode chip 126 todischarge green light emitted from the green light emitting diode chip126 to the outside. The red light emitting diode part 104 employs theblue light emitting diode chip 122 to discharge red light throughwavelength conversion of blue light emitted from the blue light emittingdiode chip 122. Although the red light emitting diode part 104 isconfigured to perform wavelength conversion in this exemplaryembodiment, the red light emitting diode part 104 may employ a red lightemitting diode chip to discharge red light emitted from the red lightemitting diode chip, as needed.

This exemplary embodiment will be described mainly with reference to theblue light emitting diode part 102. The blue light emitting diode part102 may include a substrate 110, the blue light emitting diode chip 122,a first substrate electrode 132, a second substrate electrode 134, andan insulating portion 140.

The substrate 110 serves to support the light emitting diode package andthe light emitting diode chip. In this exemplary embodiment, thesubstrate 110 may be formed of an insulating material and have apredetermined thickness.

The blue light emitting diode chip 122 is disposed on the substrate 110and may emit light upon receiving power from an external power source.As shown in FIG. 1, the blue light emitting diode chip 122 includes alight emitting structure 29, an n-type electrode 31, a p-type electrode33, an n-type bump 35, a p-type bump 37, and an encapsulation portion39. The light emitting structure 29 may include an n-type semiconductorlayer 23, an active layer 25, and a p-type semiconductor layer 27.

Each of the n-type semiconductor layer 23, the active layer 25 and thep-type semiconductor layer 27 may include Group III-V based compoundsemiconductors. By way of example, each of the n-type semiconductorlayer 23, the active layer 25 and the p-type semiconductor layer 27 mayinclude nitride semiconductors such as (Al, Ga, In)N. The n-typesemiconductor layer 23 may be interchangeably placed with the p-typesemiconductor layer 27.

The n-type semiconductor layer 23 may be a conductive semiconductorlayer containing n-type dopants (for example, Si), and the p-typesemiconductor layer 27 may be a conductive semiconductor layercontaining p-type dopants (for example, Mg). The active layer 25 isinterposed between the n-type semiconductor layer 23 and the p-typesemiconductor layer 27, and may include a multi-quantum well (MQW)structure. The composition of the active layer 25 may be determined toemit light having a desired peak wavelength.

In this exemplary embodiment, the composition of the active layer 25 maybe determined such that the blue light emitting diode chip 122 can emitlight having a peak wavelength in the blue wavelength band. In addition,in the structure wherein the green light emitting diode part 106 employsthe green light emitting diode chip 126, the composition of the activelayer 25 may be determined such that the green light emitting diode chip126 can emit light having a peak wavelength in the green wavelengthband. Further, in the structure wherein the red light emitting diodepart 104 employs the red light emitting diode chip, the composition ofthe active layer 25 may be determined such that the red light emittingdiode chip can emit light having a peak wavelength in the red wavelengthband.

The light emitting structure 29 of the blue light emitting diode chip122 or the green light emitting diode chip 126 may be an AlInGaN-basednitride semiconductor, and the light emitting structure 29 of the redlight emitting diode chip may be an AlGaInP-based nitride semiconductor.

Referring to FIG. 1, in the light emitting structure 29 according tothis exemplary embodiment, the active layer 25 and the n-typesemiconductor layer 23 are sequentially disposed on the p-typesemiconductor layer 27 in the stated order. In addition, a portion ofthe n-type semiconductor layer 23 may be exposed by partially removingthe p-type semiconductor layer 27 and the active layer 25.

The p-type electrode 33 is disposed on a lower surface of the p-typesemiconductor layer 27 to be electrically connected to the p-typesemiconductor layer 27. In addition, the n-type electrode 31 is disposedon the exposed portion of the n-type semiconductor layer 23 to beelectrically connected to the n-type semiconductor layer 23. That is, inthis exemplary embodiment, the blue light emitting diode chip 122 mayhave a horizontal structure in which the n-type electrode 31 and thep-type electrode 33 are arranged in the same direction.

The encapsulation portion 39 may be disposed on the lower surface of thelight emitting structure 29 to cover the n-type electrode 31, the p-typeelectrode 33 and the light emitting structure 29. The encapsulationportion 39 exhibits electrically insulating properties and can protectthe light emitting structure 29, the n-type electrode 31 and the p-typeelectrode 33 from external environments. In this exemplary embodiment,the encapsulation portion 39 may be formed of a transparent material.Alternatively, the encapsulation portion 39 may be formed of an opaquematerial or a translucent material, as needed. Here, the encapsulationportion 39 may have the same width as the light emitting structure 29.

Each of the n-type bump 35 and the p-type bump 37 may be disposed tocover a portion of a lower surface of the encapsulation portion 39. Inaddition, the n-type bump 35 may be electrically connected to the n-typeelectrode 31 and the p-type bump 37 may be electrically connected to thep-type electrode 33 through via-holes formed in the encapsulationportion 39. The n-type bump 35 and the p-type bump 37 are spaced apartfrom each other on the lower surface of the encapsulation portion 39 tobe electrically insulated from each other.

The first substrate electrode 132 and the second substrate electrode 134are provided to the substrate 110. The first substrate electrode 132extends from an upper surface of the substrate 110 to a lower surfacethereof through the substrate 110. That is, a portion of the firstsubstrate electrode 132 is disposed on the upper surface of thesubstrate 110 and another portion of the first substrate electrode 132is disposed on the lower surface of the substrate 110 such that bothportions of the first substrate electrode 132 are electrically connectedto each other through a via-hole formed in the substrate 110. Like thefirst substrate electrode 132, portions of the second substrateelectrode 134 are disposed on the upper and lower surfaces of thesubstrate 110, respectively, and are electrically connected to eachother through a via-hole formed in the substrate 110. In this exemplaryembodiment, the first substrate electrode 132 may be spaced apart fromthe second substrate electrode 134 to be electrically insulated fromeach other.

The portions of the first substrate electrode 132 and the secondsubstrate electrode 134 disposed on the upper surface of the substrate110 may be electrically connected to the n-type bump 35 and the p-typebump 37 of the light emitting diode chip, and may be electrically bondedthereto by a bonding portion S. That is, the light emitting diode chipis disposed on the substrate 110 such that the n-type bump 35 and thep-type bump 37 disposed on the lower surface of the light emitting diodechip are electrically connected to the first substrate electrode 132 andthe second substrate electrode 134, respectively.

The insulating portion 140 may be disposed to cover the light emittingdiode chip and the upper surface of the substrate 110. The insulatingportion 140 serves to protect the light emitting structure 29 of thelight emitting diode chip from external environments and to prevent anelectrical short-circuit due to foreign matter. In this exemplaryembodiment, the insulating portion 140 may be formed of a transparentmaterial or a translucent material to allow light emitted from the lightemitting diode chip to be discharged outside therethrough. For example,the insulating portion 140 may include at least one ofpolydimethylsiloxane (PDMS), polyimide, poly(methyl methacrylate)(PMMA), and a ceramic material.

The blue light emitting diode part 102, the red light emitting diodepart 104, and the green light emitting diode part 106 are arranged on anupper surface of the printed circuit board 200, which supports the bluelight emitting diode part 102, the red light emitting diode part 104,and the green light emitting diode part 106. The printed circuit board200 may include a plurality of interconnection wires to supply electricpower from an external power source to each of the blue light emittingdiode part 102, the red light emitting diode part 104, and the greenlight emitting diode part 106.

In addition, as shown in FIG. 1, the printed circuit board 200 includeselectrodes such that, in each of the blue light emitting diode part 102,the red light emitting diode part 104, and the green light emittingdiode part 106, second substrate electrodes 134 are connected as commonelectrodes and first substrate electrodes 132 are connected asindividual electrodes. With this structure, the blue light emittingdiode part 102, the red light emitting diode part 104, and the greenlight emitting diode part 106 disposed on the printed circuit board 200can be independently driven.

FIGS. 2A-2L show sectional views illustrating a method of manufacturingthe display apparatus according to the first exemplary embodiment.

The method of manufacturing the display apparatus 100 according to thefirst exemplary embodiment will be described with reference to FIGS.2A-2L. The following description will focus on the method ofmanufacturing the blue light emitting diode part 102, and description ofmethods of manufacturing the red light emitting diode part 104, and thegreen light emitting diode part 106 will be omitted since thesemanufacturing methods are the same as the method of manufacturing theblue light emitting diode part 102.

Referring to FIG. 2A, a plurality of light emitting structures 29 isdisposed on a first manufacturing substrate 51. In this exemplaryembodiment, each of the light emitting structures 29 shown in theenlarged portion of FIG. 1 includes an n-type semiconductor layer 23, anactive layer 25, and a p-type semiconductor layer 27, which aresequentially stacked in the stated order, and an upper surface of then-type semiconductor layer 23 is partially exposed by partially removingthe active layer 25 and the p-type semiconductor layer 27. In addition,as shown in FIG. 2A, an n-type electrode 31 is disposed in an exposedregion of the upper surface of the n-type semiconductor layer 23 and ap-type electrode 33 is disposed on an upper surface of the p-typesemiconductor layer 27. The light emitting structures 29 are spacedapart from one another on the first manufacturing substrate 51. Like thesubstrate 110, the first manufacturing substrate 51 may be formed of aninsulating material and may have a predetermined thickness.

Referring to FIG. 2B, with the plurality of light emitting structures 29disposed on the first manufacturing substrate 51, an encapsulationportion 39 is formed to cover the first manufacturing substrate 51 andthe plurality of light emitting structures 29, and an n-type bump 35 anda p-type bump 37 are formed through via-holes formed in theencapsulation portion 39. The n-type bump 35 is disposed on the n-typeelectrode 31 to be electrically connected to the n-type electrode 31,and the p-type bump 37 is disposed on the p-type electrode 33 to beelectrically connected to the p-type electrode 33.

Referring to FIG. 2C, a first manufacturing insulating portion 53 isformed to cover the n-type bump 35, the p-type bump 37, and theencapsulation portion 39. The first manufacturing insulating portion 53may include at least one of polydimethylsiloxane (PDMS), polyimide,poly(methyl methacrylate) (PMMA), and a ceramic material. Here, thefirst manufacturing insulating portion 53 may be formed to have a flatupper surface by filling a space between the light emitting structures29, as shown in FIG. 2C.

Then, referring to FIG. 2D, the n-type bump 35 and the p-type bump 37are exposed by etching, for example, dry etching, the firstmanufacturing insulating portion 53. Here, the first manufacturinginsulating portion 53 may be subjected to etching such that uppersurfaces of the n-type bump 35 and the p-type bump 37 can be exposed.

With the n-type bump 35 and the p-type bump 37 exposed, the lightemitting structures 29 are isolated from one another to form blue lightemitting diode chips 122, which in turn are mounted on the substrate 110on a second manufacturing substrate 55. FIG. 2E shows a structurewherein plural blue light emitting diode chips 122 are disposed on thesubstrate 110. Here, the substrate 110 is disposed on the secondmanufacturing substrate 55 and includes first substrate electrodes 132and second substrate electrodes 134. Each of the blue light emittingdiode chips 122 is electrically connected to the first substrateelectrode 132 and the second substrate electrode 134 by a bondingportion S.

Referring to FIG. 2F, with the plural blue light emitting diode chips122 disposed on the substrate 110, an insulating portion 140 is formedto cover the substrate 110 and the plural blue light emitting diodechips 122. The insulating portion 140 may include at least one ofpolydimethylsiloxane (PDMS), polyimide, poly(methyl methacrylate)(PMMA), and a ceramic material. The insulating portion 140 may be formedto have a flat upper surface by filling a space between the blue lightemitting diode chip 122, as shown in FIG. 2F.

Referring to FIG. 2G, a second buffer layer 57 b, a third buffer layer57 a, and a third manufacturing substrate 57 are sequentially formed onthe upper surface of the insulating portion 140. The third manufacturingsubstrate 57 may be formed of an insulating material and may have apredetermined thickness, like the first manufacturing substrate 51 andthe second manufacturing substrate 55. The third buffer layer 57 a isdisposed under the third manufacturing substrate 57 and the secondbuffer layer 57 b is disposed under the third buffer layer 57 a. Thethird buffer layer 57 a may include, for example, ITO and the secondbuffer layer 57 b may include at least one of polydimethylsiloxane(PDMS), polyimide, poly(methyl methacrylate) (PMMA), and a ceramicmaterial.

Here, the third buffer layer 57 a and the second buffer layer 57 b areprovided to prevent damage to the insulating portion 140 coupled to alower surface of the third manufacturing substrate 57 upon removal ofthe third manufacturing substrate 57.

Referring to FIG. 2H, after the third manufacturing substrate 57 iscoupled to an upper surface of the third buffer layer, the secondmanufacturing substrate 55 is removed from the lower surface of thesubstrate. The second manufacturing substrate 55 is removed from thelower surface of the substrate 110 so as not to prevent damage to thefirst substrate electrodes 132 and the second substrate electrodes 134.

Referring to FIG. 2I, the plural blue light emitting diode chips 122 areisolated from each other by a dicing process in which a region betweenthe blue light emitting diode chips is removed. Here, the thirdmanufacturing substrate 57 is not subjected to dicing and the thirdbuffer layer 57 a, or the second buffer layer 57 b may be partiallyremoved.

As a result, the plurality of blue light emitting diode parts 102 may bearranged at regular intervals on a lower surface of the thirdmanufacturing substrate 57. Here, a width L1 of each of the blue lightemitting diode parts 102 may be several times less than a distance L2between the blue light emitting diode parts 102. For example, the widthL1 of each of the blue light emitting diode parts 102 may be 150 μm andthe distance L2 between the blue light emitting diode parts 102 may be375 μm or more. Although FIG. 2I shows the structure wherein thedistance between the blue light emitting diode parts 102 is small, theblue light emitting diode parts 102 may be arranged at relatively wideintervals, as shown in FIG. 2J.

Referring to FIG. 2J, the plural blue light emitting diode parts 102coupled to the third manufacturing substrate 57 may be transferred to anupper surface of a printed circuit board 200. To this end, force may beapplied to the third manufacturing substrate 57 from above the thirdmanufacturing substrate 57 such that each of the blue light emittingdiode parts 102 can be coupled to the printed circuit board 200. Here, abonding portion S may be applied to the printed circuit board 200.

Referring to FIG. 2K, the blue light emitting diode parts 102 may becoupled to the upper surface of the printed circuit board 200 by thebonding portion S such that interconnection wires of the printed circuitboard 200 can be electrically connected to the first substrate electrode132 and the second substrate electrode 134 of each of the blue lightemitting diode parts 102.

Referring to FIG. 2L, the display apparatus 100 may be manufactured bycoupling red light emitting diode parts 104 and green light emittingdiode parts 106 to the printed circuit board 200 through the processesdescribed above.

FIG. 3 is a sectional view of part of a display apparatus according to asecond exemplary embodiment.

Referring to FIG. 3, the display apparatus 100 includes a blue lightemitting diode part 102, a red light emitting diode part 104, a greenlight emitting diode part 106, and a printed circuit board 200.

As in the first exemplary embodiment, the blue light emitting diode part102 according to this exemplary embodiment employs a blue light emittingdiode chip 122 to discharge blue light emitted from the blue lightemitting diode chip 122 to the outside, and the green light emittingdiode part 106 employs a green light emitting diode chip 126 todischarge green light emitted from the green light emitting diode chip126 to the outside. The red light emitting diode part 104 employs theblue light emitting diode chip 122 to discharge red light throughwavelength conversion of blue light emitted from the blue light emittingdiode chip 122. Although the red light emitting diode part 104 isconfigured to perform wavelength conversion in this exemplaryembodiment, the red light emitting diode part 104 may employ a red lightemitting diode chip to discharge red light emitted from the red lightemitting diode chip, as needed.

In this exemplary embodiment, the blue light emitting diode part 102includes the blue light emitting diode chip 122, a first substrateelectrode 132, a second substrate electrode 134, an insulating portion140, and a connection electrode 180.

As shown in FIG. 3, the blue light emitting diode chip 122 has avertical structure and may include a light emitting structure 29 and ap-type electrode 33. Here, the light emitting structure 29 may includean n-type semiconductor layer 23, an active layer 25, and a p-typesemiconductor layer 27.

The light emitting structure 29 includes a p-type semiconductor layer 27disposed at a lower side thereof, an n-type semiconductor layer 23disposed at an upper surface thereof, and an active layer 25 interposedbetween the p-type semiconductor layer 27 and the n-type semiconductorlayer 23. Although an n-type electrode 31 may be disposed on an uppersurface of the n-type semiconductor layer 23, description of the n-typeelectrode 31 is omitted in this exemplary embodiment.

The p-type electrode 33 is disposed on a lower surface of the p-typesemiconductor layer 27 and includes first to third electrode portions 33a, 33 b, 33 c. The first electrode portion 33 a electrically contactsthe p-type electrode 33, and the second electrode portion 33 b and thethird electrode portion 33 c are sequentially disposed on a lowersurface of the first electrode portion 33 a. In this exemplaryembodiment, the first electrode portion 33 a may include gold (Au), thesecond electrode portion 33 b may include aluminum (Al), and the thirdelectrode portion 33 c may include silver (Ag).

Although the p-type electrode 33 according to this exemplary embodimenthas a multilayer structure including the first to third electrodeportions 33 a, 33 b, 33 c, the p-type electrode 33 may have a monolayerstructure, as needed, and the p-type electrode 33 may have a thinnerthickness than that shown in FIG. 3.

In this exemplary embodiment, the light emitting structure 29 isdisposed on the first substrate electrode 132 and the p-type electrode33 of the light emitting structure 29 is electrically connected to thefirst substrate electrode 132. Here, the p-type electrode 33 may becoupled to the first substrate electrode 132 by a bonding portion S.

In addition, the connection electrode 180 is disposed to cover the uppersurface of the n-type semiconductor layer 23. The connection electrode180 electrically connects the n-type semiconductor layer 23 to thesecond substrate electrode 134 and may include a transparent material,for example, ITO or ZnO, to allow light emitted from the blue lightemitting diode chip 122 to pass therethrough.

The first substrate electrode 132 and the second substrate electrode 134are disposed under the blue light emitting diode chip 122 and are spacedapart from each other so as to be electrically insulated from eachother. As described above, the first substrate electrode 132 iselectrically connected to the p-type electrode 33 and the secondsubstrate electrode 134 is electrically connected to the n-typesemiconductor layer 23 through the connection electrode 180.

The insulating portion 140 is disposed to cover the blue light emittingdiode chip 122. The insulating portion 140 serves to protect the bluelight emitting diode chip 122 and the connection electrode 180 from theexternal environment and to prevent an electrical short-circuit due toforeign matter. In this exemplary embodiment, the insulating portion 140may be formed of a transparent material or a translucent material toallow light emitted from the blue light emitting diode chip 122 to bedischarged outside therethrough. For example, the insulating portion 140may include at least one of polydimethylsiloxane (PDMS), polyimide,poly(methyl methacrylate) (PMMA), and a ceramic material.

Further, in this exemplary embodiment, a second manufacturing insulatingportion 61 is disposed between the blue light emitting diode chip 122and the connection electrode 180. The second manufacturing insulatingportion 61 is formed prior to the insulating portion 140 by a differentprocess from the process of forming the insulating portion 140 inmanufacture of the display apparatus 100 according to this exemplaryembodiment. The second manufacturing insulating portion 61 is formed ofthe same material as the insulating portion 140 and may contact theinsulating portion 140 excluding a region in which the connectionelectrode 180 is disposed. That is, in the blue light emitting diodepart 102 according to this exemplary embodiment, the secondmanufacturing insulating portion 61 may have the same structure as theinsulating portion 140.

The blue light emitting diode part 102, the red light emitting diodepart 104 and the green light emitting diode part 106 are arranged on anupper surface of the printed circuit board 200, which supports the bluelight emitting diode part 102, the red light emitting diode part 104 andthe green light emitting diode part 106. In addition, the printedcircuit board 200 may include a plurality of interconnection wires tosupply electric power from an external power source to the blue lightemitting diode part 102, the red light emitting diode part 104 and thegreen light emitting diode part 106.

FIG. 4A-FIG. 4S show sectional views illustrating a method ofmanufacturing the display apparatus according to the second exemplaryembodiment of the present invention.

The method of manufacturing the display apparatus 100 according to thesecond exemplary embodiment will be described with reference to FIG.4A-FIG. 4S. The following description will focus on the method ofmanufacturing the blue light emitting diode part 102, and description ofmethods of manufacturing the red light emitting diode part 104 and thegreen light emitting diode part 106 will be omitted since thesemanufacturing methods are the same as the method of manufacturing theblue light emitting diode part 102.

Referring to FIG. 4A, an n-type semiconductor layer 23, an active layer25 and a p-type semiconductor layer 27 are sequentially stacked on afirst manufacturing substrate 51.

Referring to FIG. 4B, a plurality of p-type electrodes 33 are formed onthe stacked structure of the n-type semiconductor layer 23, the activelayer 25, and the p-type semiconductor layer 27. Here, each of thep-type electrodes 33 includes first to fourth electrode portions 33 a,33 b, 33 c, 33 d, which are sequentially stacked on an upper surface ofthe p-type semiconductor layer 27. The p-type electrodes 33 areregularly arranged at constant intervals in rows and columns.

The first electrode portion 33 a may include gold (Au), the secondelectrode portion 33 b may include aluminum (Al), the third electrodeportion 33 c may include silver (Ag), and the fourth electrode portion33 d may include chromium (Cr).

Referring to FIG. 4C, a plurality of light emitting structures 29 eachhaving the same width as the p-type electrode 33 is formed by etchingthe n-type semiconductor layer 23, the active layer 25 and the p-typesemiconductor layer 27 with reference to each of the p-type electrodes33. That is, the plurality of light emitting structures 29 are disposedunder the p-type electrodes 33, respectively.

After the plurality of light emitting structures 29 are formed, a firstmanufacturing insulating portion 53 is formed on the first manufacturingsubstrate 51 to cover the plurality of light emitting structures 29 andthe p-type electrode 33, as shown in FIG. 4D. The first manufacturinginsulating portion 53 is formed to have a flat upper surface by fillinga space between the light emitting structures 29. The firstmanufacturing insulating portion 53 may be formed of a transparentmaterial or a translucent material. For example, the first manufacturinginsulating portion 53 may include at least one of polydimethylsiloxane(PDMS), polyimide, poly(methyl methacrylate) (PMMA), and a ceramicmaterial.

Referring to FIG. 4E, the fourth electrode portions 33 d are exposed onthe first manufacturing insulating portion 53 by etching an upperportion of the first manufacturing insulating portion 53. Etching of thefirst manufacturing insulating portion 53 may be performed by dryetching until the third electrode portions 33 c are exposed. Thereafter,the fourth electrode portions 33 d are removed by separate etching.

Next, referring to FIG. 4F, the first manufacturing substrate 51 isturned upside down to couple the third electrode portions 33c to firstsubstrate electrodes 132. Here, the first substrate electrodes 132 andsecond substrate electrodes 134 are disposed on the second manufacturingsubstrate 55, and a first substrate buffer layer 55 a and a secondsubstrate buffer layer 55 b may be formed on the second manufacturingsubstrate 55. The first substrate buffer layer 55 a may be formed of ITOand the second substrate buffer layer 55 b may be formed of SiO₂.

That is, the first manufacturing substrate 51 and the secondmanufacturing substrate 55 are disposed on the second substrate bufferlayer 55 b. Here, the first manufacturing substrate 51 and the secondmanufacturing substrate 55 may be spaced apart from each other.

Then, a bonding portion S is formed on the first substrate electrodes132. Thus, when the first manufacturing substrate 51 is compresseddownward, the p-type electrodes 33 can be coupled to the firstmanufacturing substrate 51 on which the bonding portion S is formed,while contacting the second manufacturing substrate 55 on which thebonding portion S is not formed.

As a result, blue light emitting diode chips 122 are formed on the firstsubstrate electrodes 132, as shown in FIG. 4G. That is, the blue lightemitting diode chips 122 may be separated from the first manufacturinginsulating portion 53 and coupled to the upper surface of the firstmanufacturing substrate 51.

Referring to FIG. 4H, a shielding portion 59 is formed on the secondsubstrate electrodes 134. The shielding portion 59 may be formed to havea greater height than the blue light emitting diode chips 122. Theshielding portion 59 may be formed of a transparent or opaque materialand may exhibit electrically insulating or conductive properties.

Referring to FIG. 4I, a second manufacturing insulating portion 61 isformed on the second manufacturing substrate 55 to cover the blue lightemitting diode chips 122 and the shielding portion 59. The secondmanufacturing insulating portion 61 may be formed of the same materialas the first manufacturing insulating portion 53. The secondmanufacturing insulating portion 61 may be formed to fill spaces betweenthe first substrate electrodes 132 and the second substrate electrodes134. With this structure, the second manufacturing insulating portion 61is interposed between the first substrate electrodes 132 and the secondsubstrate electrodes 134 such that the first substrate electrodes 132and the second substrate electrodes 134 can be electrically insulatedfrom each other while being coupled to each other instead of beingseparated from each other.

Referring to FIG. 4J, the n-type semiconductor layer 23 of the bluelight emitting diode chip 122 is partially exposed by etching the secondmanufacturing insulating portion 61 and the shielding portion 59. Here,the second manufacturing insulating portion 61 and the shielding portion59 may be etched such that upper surfaces of the second manufacturinginsulating portion 61 and the shielding portion 59 are flush with eachother, and the n-type semiconductor layer 23 may protrude from the uppersurface of the second manufacturing insulating portion 61.

Next, the shielding portion 59 is removed by lift-off, as shown in FIG.4K, and a connection electrode 180 is formed as shown in FIG. 4L. Theconnection electrode 180 may be formed of a transparent material, forexample, ITO or ZnO, and cover the n-type semiconductor layer 23 exposedon the upper surface of the second manufacturing insulating portion 61to be electrically connected thereto. In addition, the connectionelectrode 180 extends along the upper and side surfaces of the secondmanufacturing insulating portion 61 to an upper surface of the secondsubstrate electrode 134. With this structure, the connection electrode180 can be electrically connected to the second substrate electrode 134.In addition, the connection electrode 180 extends to cover the n-typesemiconductor layer 23 of adjacent blue light emitting diode chips 122.

After the connection electrode 180 is formed as described above, aninsulating portion 140 is formed to cover the connection electrode 180and the second manufacturing insulating portion 61, as shown in FIG. 4M.The insulating portion 140 may be formed of the same transparent ortranslucent material as the second manufacturing insulating portion 61.The insulating portion 140 may be formed to have a flat upper surface.

Referring to FIG. 4N, a third manufacturing substrate 57 is coupled toan upper portion of the insulating portion 140. Here, a third bufferlayer 57 a may be formed between the third manufacturing substrate 57and the insulating portion 140. The third buffer layer 57 a may beformed of ITO.

Referring to FIG. 4O, after the third manufacturing substrate 57 iscoupled to the insulating portion 140, the second manufacturingsubstrate 55 is removed from the lower surface of the substrate. Thefirst substrate buffer layer 55 a and the second substrate buffer layer55 b can prevent damage to the first substrate electrode 132, the secondsubstrate electrode 134 and the second manufacturing insulating portion61 upon removal of the second manufacturing substrate 55.

Referring to FIG. 4P, the plural blue light emitting diode chips 122 areisolated from each other. Here, isolation of the blue light emittingdiode chips 122 is performed with reference to a central region of thesecond substrate electrode 134. As a result, the plural blue lightemitting diode parts 102 are arranged on a lower surface of the thirdmanufacturing substrate 57.

In this exemplary embodiment, a width L3 of each of the blue lightemitting diode parts 102 may be several times less than a distance L4between the blue light emitting diode parts 102. For example, the widthL3 of each of the blue light emitting diode parts 102 may be 20 μ andthe distance L4 between the blue light emitting diode parts 102 may be100 μm or more. Although FIG. 4P shows the structure wherein thedistance between the blue light emitting diode parts 102 is small, theblue light emitting diode parts 102 may be arranged at wide intervals,as shown in FIG. 4Q.

Referring to FIG. 4Q, the plural blue light emitting diode parts 102coupled to the third manufacturing substrate 57 may be transferred to anupper surface of a printed circuit board 200. To this end, force may beapplied to the third manufacturing substrate 57 from above the thirdmanufacturing substrate 57 such that each of the blue light emittingdiode parts 102 can be coupled to the printed circuit board 200. Here, abonding portion S may be applied to the printed circuit board 200.

Referring to FIG. 4R, the blue light emitting diode parts 102 may becoupled to the upper surface of the printed circuit board 200 by thebonding portion S such that interconnection wires of the printed circuitboard 200 can be electrically connected to the first substrate electrode132 and the second substrate electrode 134 of each of the blue lightemitting diode parts 102.

Referring to FIG. 4S, the display apparatus 100 may be manufactured bycoupling red light emitting diode parts 104 and green light emittingdiode parts 106 to the printed circuit board 200 through the processesdescribed above.

FIG. 5 is a sectional view of part of a display apparatus according to athird exemplary embodiment.

Referring to FIG. 5, the display apparatus 100 includes a blue lightemitting diode part 102, a red light emitting diode part 104, a greenlight emitting diode part 106, and a circuit board 200.

The blue light emitting diode part 102 includes a substrate 110, a bluelight emitting diode chip 122, a first substrate electrode 132, a secondsubstrate electrode 134, and an insulating portion 140.

The substrate 110 supports the blue light emitting diode package 100 andthe light emitting diode chip 120. In this exemplary embodiment, thesubstrate 110 may include an insulating material and have apredetermined thickness.

The blue light emitting diode chip 122 is disposed on the substrate 110and may emit light upon receiving power from an external power source.As shown in FIG. 5, the blue light emitting diode chip 122 includes alight emitting structure 29, an n-type electrode 31, a p-type electrode33, an n-type bump 35, a p-type bump 37, and an encapsulation portion39. The light emitting structure 29 may include an n-type semiconductorlayer 23, an active layer 25, and a p-type semiconductor layer 27.

Each of the n-type semiconductor layer 23, the active layer 25 and thep-type semiconductor layer 27 may include Group III-V based compoundsemiconductors. By way of example, each of the n-type semiconductorlayer 23, the active layer 25 and the p-type semiconductor layer 27 mayinclude nitride semiconductors such as (Al, Ga, In)N. The n-typesemiconductor layer 23 may be interchangeably placed with the p-typesemiconductor layer 27.

The n-type semiconductor layer 23 may be a conductive semiconductorlayer containing n-type dopants (for example, Si), and the p-typesemiconductor layer 27 may be a conductive semiconductor layercontaining p-type dopants (for example, Mg). The active layer 25 isinterposed between the n-type semiconductor layer 23 and the p-typesemiconductor layer 27, and may include a multi-quantum well (MQW)structure. The composition of the active layer 25 may be determined toemit light having a desired peak wavelength. In this exemplaryembodiment, the composition of the active layer 25 may be determinedsuch that the blue light emitting diode chip 122 can emit light having apeak wavelength in the blue wavelength band. By way of example, thelight emitting structure 29 may be an AlInGaN-based nitridesemiconductor.

Referring again to FIG. 5, in the light emitting structure 29 accordingto this exemplary embodiment, the active layer 25 and the n-typesemiconductor layer 23 are sequentially disposed on the p-typesemiconductor layer 27 in the stated order. In addition, a portion ofthe n-type semiconductor layer 23 may be exposed by partially removingthe p-type semiconductor layer 27 and the active layer 25.

The n-type electrode 31 is disposed on a lower surface of the n-typesemiconductor layer 23 to be electrically connected to the n-typesemiconductor layer 23 and the p-type electrode 33 is disposed on alower surface of the p-type semiconductor layer 27 to be electricallyconnected to the p-type semiconductor layer 27. That is, in thisexemplary embodiment, the blue light emitting diode chip 122 may have ahorizontal structure in which the n-type electrode 31 and the p-typeelectrode 33 are arranged in the same direction.

The encapsulation portion 39 may be disposed on the lower surface of thelight emitting structure 29 to cover the n-type electrode 31, the p-typeelectrode 33 and the light emitting structure 29. The encapsulationportion 39 exhibits electrically insulating properties and can protectthe light emitting structure 29, the n-type electrode 31 and the p-typeelectrode 33 from external environments. In this exemplary embodiment,the encapsulation portion 39 may be formed of a transparent material.Alternatively, the encapsulation portion 39 may be formed of an opaquematerial or a translucent material, as needed. Here, the encapsulationportion 39 may have the same width as the light emitting structure 29.

The n-type bump 35 and the p-type bump 37 may be disposed to cover aportion of a lower surface of the encapsulation portion 39 and may beelectrically connected to the n-type electrode 31 and the p-typeelectrode 33 through via-holes formed in the encapsulation portion 39,respectively. The n-type bump 35 and the p-type bump 37 are spaced apartfrom each other on the lower surface of the encapsulation portion 39 tobe electrically insulated from each other.

The first substrate electrode 132 and the second substrate electrode 134are provided to the substrate 110. The first substrate electrode 132extends from an upper surface of the substrate 110 to a lower surfacethereof through the substrate 110. That is, a portion of the firstsubstrate electrode 132 is disposed on the upper surface of thesubstrate 110 and another portion of the first substrate electrode 132is disposed on the lower surface of the substrate 110 such that bothportions of the first substrate electrode 132 are electrically connectedto each other through a via-hole formed in the substrate 110. Like thefirst substrate electrode 132, portions of the second substrateelectrode 134 are disposed on the upper and lower surfaces of thesubstrate 110, respectively, and are electrically connected to eachother through a via-hole formed in the substrate 110. In this exemplaryembodiment, the first substrate electrode 132 may be spaced apart fromthe second substrate electrode 134 to be electrically insulated fromeach other.

The portions of the first substrate electrode 132 and the secondsubstrate electrode 134 disposed on the upper surface of the substrate110 may be electrically connected to the n-type bump 35 and the p-typebump 37 of the light emitting diode chip 120, and may be bonded theretoby a bonding portion S. That is, the light emitting diode chip 120 isdisposed on the substrate 110 such that the n-type bump 35 and thep-type bump 37 disposed on the lower surface of the light emitting diodechip 120 are electrically connected to the first substrate electrode 132and the second substrate electrode 134, respectively.

The insulating portion 140 is disposed to cover the light emitting diodechip and the upper surface of the substrate 110. The insulating portion140 serves to protect the light emitting structure 29 of the lightemitting diode chip from external environments and to prevent electricshort due to foreign matter. In this exemplary embodiment, theinsulating portion 140 may be formed of a transparent material or atranslucent material to allow light emitted from the light emittingdiode chip to be discharged outside therethrough. For example, theinsulating portion 140 may include at least one of polydimethylsiloxane(PDMS), polyimide, poly(methyl methacrylate) (PMMA), and a ceramicmaterial.

The red light emitting diode part 104 includes a substrate 110, a bluelight emitting diode chip 122, a first substrate electrode 132, a secondsubstrate electrode 134, a phosphor portion 160, and a color filter 170.

In this exemplary embodiment, the substrate 110, the blue light emittingdiode chip 122, the first substrate electrode 132 and the secondsubstrate electrode 134 of the red light emitting diode part 104 are thesame as those of the blue light emitting diode part 102 and detaileddescriptions thereof will be omitted.

As in the insulating portion 140 of the blue light emitting diode part102, the phosphor portion 160 may be disposed to cover the blue lightemitting diode chip 122 and an upper surface of the substrate 110. Thephosphor portion 160 may contain at least one type of phosphor.Specifically, the phosphor portion 160 may contain a phosphor capable ofemitting red light through wavelength conversion of blue light emittedfrom the blue light emitting diode chip 122.

Although the red light emitting diode part 104 includes the blue lightemitting diode chip 122 in this exemplary embodiment, the red lightemitting diode part 104 may include a UV light emitting diode chip, asneeded. In the structure wherein the red light emitting diode part 104includes the UV light emitting diode chip, the phosphor portion 160 maycontain a phosphor capable of emitting red light through wavelengthconversion of UV light emitted from the UV light emitting diode chip122.

According to this exemplary embodiment, the phosphor portion 160 mayinclude at least one type of phosphor together with at least one ofpolydimethylsiloxane (PDMS), polyimide, poly(methyl methacrylate)(PMMA), and a ceramic material, which are transparent or translucentmaterials.

The color filter 170 may be disposed to cover upper and side surfaces ofthe phosphor portion 160 and the side surface of the substrate 110. Thecolor filter 170 serves to block light in a predetermined range ofwavelengths among light emitted through the phosphor portion 160. Inthis exemplary embodiment, the color filter 170 blocks blue lightemitted from the blue light emitting diode chip 122 while allowing redlight emitted from the phosphor portion 160 through wavelengthconversion to pass therethrough. Accordingly, the color filter 170 canminimize discharge of blue light from the light emitting diode package.That is, the color filter 170 is provided to the light emitting diodepackage in order to maximize the ratio of light subjected to wavelengthconversion by the phosphor portion 160 to light emitted through thecolor filter 170.

The color filter 170 may have as small a thickness as possible on theupper and side surfaces of the phosphor portion 160 while blocking asmuch blue light emitted from the blue light emitting diode chip 122 aspossible.

In the structure wherein the red light emitting diode part 104 includesthe UV light emitting diode chip instead of the blue light emittingdiode chip 122, the color filter 170 may block UV light emitted from theUV light emitting diode chip. As a result, the color filter can minimizedischarge of UV light from the light emitting diode package.

The green light emitting diode part 106 includes a substrate 110, agreen light emitting diode chip 126, a first substrate electrode 132, asecond substrate electrode 134, and an insulating portion 140.

The green light emitting diode chip 126 includes a light emittingstructure 29, an n-type electrode 31, a p-type electrode 33, an n-typebump 35, a p-type bump 37, and an encapsulation portion 39, in which thelight emitting structure 29 includes an n-type semiconductor layer 23,an active layer 25, and a p-type semiconductor layer 27. The lightemitting structure 29 of the green light emitting diode chip 126 may beformed of an AlInGaN-based nitride semiconductor and the composition ofthe active layer 25 may be determined such that the green light emittingdiode chip 126 can emit light having a peak wavelength in the greenwavelength band.

The blue light emitting diode part 102, the red light emitting diodepart 104 and the green light emitting diode part 106 are arranged on anupper surface of the circuit board 200, which supports the blue lightemitting diode part 102, the red light emitting diode part 104 and thegreen light emitting diode part 106. In addition, the circuit board 200may include a plurality of interconnection lines to supply electricpower from an external power source to the blue light emitting diodepart 102, the red light emitting diode part 104 and the green lightemitting diode part 106.

In this exemplary embodiment, the circuit board 200 may be a printed thecircuit board 200 or a TFT substrate including a plurality of TFT drivecircuits therein. In the structure wherein the circuit board 200 is theTFT substrate, the TFT drive circuits of the TFT substrate may beelectrically connected to the blue light emitting diode part 102, thered light emitting diode part 104 and the green light emitting diodepart 106, respectively. As a result, the blue light emitting diode part102, the red light emitting diode part 104 and the green light emittingdiode part 106 can be independently driven by the TFT drive circuits.

Alternatively, the circuit board 200 may be a flexible printed circuitboard or a flexible TFT substrate.

FIG. 6 is a sectional view of part of a display apparatus according to afourth exemplary embodiment of the present invention.

Referring to FIG. 6, the display apparatus 100 according to the fourthexemplary embodiment includes a blue light emitting diode part 102, ared light emitting diode part 104, a green light emitting diode part106, and a coupling structure 210.

The blue light emitting diode part 102 includes a substrate 110, a bluelight emitting diode chip 122, a first substrate electrode 132, and asecond substrate electrode 134. The red light emitting diode part 104includes a substrate 110, a blue light emitting diode chip 122, a firstsubstrate electrode 132, a second substrate electrode 134, a phosphorportion 160, and a color filter 170. The green light emitting diode part106 includes a substrate 110, a green light emitting diode chip 126, afirst substrate electrode 132, and a second substrate electrode 134.

The blue light emitting diode part 102 and the green light emittingdiode part 106 according to this exemplary embodiment are the same asthose of the display apparatus according to the third exemplaryembodiment excluding the insulating portion 140, and detaileddescription thereof will be omitted. The red light emitting diode part104 according to this exemplary embodiment is the same as that of thedisplay apparatus according to the third exemplary embodiment, anddetailed description thereof will be omitted.

Unlike the third exemplary embodiment, each of the blue light emittingdiode part 102 and the green light emitting diode part 106 does notinclude the insulating portion 140, as described above. The blue lightemitting diode part 102, the red light emitting diode part 104 and thegreen light emitting diode part 106 are spaced apart from one another,and the coupling structure 210 is disposed to cover all of the bluelight emitting diode part 102, the red light emitting diode part 104 andthe green light emitting diode part 106.

The coupling structure 210 fills spaces between the blue light emittingdiode part 102, the red light emitting diode part 104 and the greenlight emitting diode part 106, and couples the blue light emitting diodepart 102, the red light emitting diode part 104 and the green lightemitting diode part 106 to form an integrated structure.

According to this embodiment, the coupling structure 210 may be formedof a transparent material or a translucent material, like the insulatingportion 140 of the third exemplary embodiment. For example, the couplingstructure 210 may include at least one of polydimethylsiloxane (PDMS),polyimide, poly(methyl methacrylate) (PMMA), a ceramic material, anepoxy resin, and a synthetic resin.

FIG. 7 is a sectional view of part of a display apparatus according to afifth exemplary embodiment of the present invention.

Referring to FIG. 7, the display apparatus 100 according to the thirdexemplary embodiment includes a coupling substrate 110 a, a blue lightemitting diode part 102, a red light emitting diode part 104, and agreen light emitting diode part 106.

The coupling substrate 110 a has a substrate including a plurality ofsubstrates 110 according to the third exemplary embodiment coupled toeach other, and is provided with a plurality of first substrateelectrodes 132 and a plurality of second substrate electrodes 134. Thefirst substrate electrodes 132 and the second substrate electrodes 134have the same structure as those of the third exemplary embodiment andare arranged on the coupling substrate 110 a such that plural pairs offirst and second substrate electrodes 132, 134 are arranged on thecoupling substrate 110 a. Here, the plural pairs of first and secondsubstrate electrodes are regularly arranged in rows and columns on thecoupling substrate 110 a.

The blue light emitting diode part 102, the red light emitting diodepart 104 and the green light emitting diode part 106 are electricallyconnected to each of the first substrate electrodes 132 and each of thesecond substrate electrodes 134. That is, each of the blue lightemitting diode part 102, the red light emitting diode part 104 and thegreen light emitting diode part 106 may be provided in plural, and theplurality of blue light emitting diode parts 102, the plurality of redlight emitting diode parts 104 and the plurality of green light emittingdiode parts 106 may be arranged in rows and columns on the couplingsubstrate 110 a.

In this exemplary embodiment, each of the blue light emitting diodeparts 102 includes a blue light emitting diode chip 122 and aninsulating portion 140, and each of the red light emitting diode parts104 includes a red light emitting diode chip 124 and an insulatingportion 140. In addition, each of the green light emitting diode parts106 includes a green light emitting diode chip 126 and an insulatingportion 140.

In the blue light emitting diode part 102, the blue light emitting diodechip 122 may be coupled to the first substrate electrode 132 and thesecond substrate electrode 134, and the insulating portion 140 may bedisposed to cover the blue light emitting diode chip 122, the firstsubstrate electrode 132 and the second substrate electrode 134. The bluelight emitting diode chip 122 may have the same structure as that of thethird exemplary embodiment, and an n-type bump 35 and a p-type bump 37may be exposed on a lower surface of the insulating portion 140.Accordingly, the n-type bump 35 and the p-type bump 37 may beelectrically connected to the first substrate electrode 132 and thesecond substrate electrode 134, respectively.

The insulating portion 140 is disposed such that the n-type bump 35 andthe p-type bump 37 can be exposed on the lower surface thereof. Withthis structure, the insulating portion 140 may be disposed so as not tocover the first substrate electrode 132 and the second substrateelectrode 134.

Each of the red light emitting diode parts 104 includes a red lightemitting diode chip 124 and an insulating portion 140. The red lightemitting diode chip 124 may include a light emitting structure 29, ann-type electrode 31, a p-type electrode 33, an n-type bump 35, a p-typebump 37, and an encapsulation portion 39. The light emitting structure29 may include an n-type semiconductor layer 23, an active layer 25, anda p-type semiconductor layer 27. The light emitting structure 29 may beformed of an AlInGaP-based nitride semiconductor. In this exemplaryembodiment, the composition of the active layer 25 may be determinedsuch that the red light emitting diode chip 124 can emit light having apeak wavelength in the red wavelength band.

The arrangement of the red light emitting diode chip 124 and theinsulating portion 140 may be the same as that of the blue lightemitting diode part 102.

Each of the green light emitting diode parts 106 includes a green lightemitting diode chip 126 and an insulating portion 140. The green lightemitting diode chip 126 includes a light emitting structure 29, ann-type electrode 31, a p-type electrode 33, and an n-type bump 35. Thelight emitting structure 29 may include an n-type semiconductor layer23, an active layer 25, and a p-type semiconductor layer 27. In thisexemplary embodiment, the composition of the active layer 25 may bedetermined such that the green light emitting diode chip 126 can emitlight having a peak wavelength in the green wavelength band. The lightemitting structure 29 may be formed of an AlInGaN-based nitridesemiconductor.

The arrangement of the green light emitting diode chip 126 and theinsulating portion 140 may be the same as that of the blue lightemitting diode part 102.

FIG. 8 is a sectional view of part of a display apparatus according to asixth exemplary embodiment of the present invention.

Referring to FIG. 8, the display apparatus 100 according to the sixthexemplary embodiment includes a blue light emitting diode part 102, ared light emitting diode part 104, a green light emitting diode part106, and a coupling structure 210.

The blue light emitting diode part 102 and the green light emittingdiode part 106 are the same as those of the fifth exemplary embodiment,and detailed description thereof will be omitted.

The red light emitting diode part 104 includes a substrate 110, a redlight emitting diode chip 124, a first substrate electrode 132, and asecond substrate electrode 134. As in the blue light emitting diode part102 according to the third exemplary embodiment, the first substrateelectrode 132 and the second substrate electrode 134 according to thisexemplary embodiment are coupled to the substrate 110, and the red lightemitting diode chip 124 is electrically coupled to the first substrateelectrode 132 and the second substrate electrode 134 on the substrate110. The red light emitting diode chip 124 may have the same structureand composition as that of the red light emitting diode packageaccording to the third exemplary embodiment.

With the blue light emitting diode part 102, the red light emittingdiode part 104 and the green light emitting diode part 106 arranged asshown in FIG. 8, the coupling structure 210 is disposed to cover theblue light emitting diode part 102, the red light emitting diode part104 and the green light emitting diode part 106. As in the fourthexemplary embodiment, the coupling structure 210 fills spaces betweenthe blue light emitting diode part 102, the red light emitting diodepart 104 and the green light emitting diode part 106, and serves tocouple the blue light emitting diode part 102, the red light emittingdiode part 104 and the green light emitting diode part 106 to form anintegrated structure.

According to this embodiment, the coupling structure 210 may be formedof a transparent material or a translucent material. For example, thecoupling structure 210 may include at least one of polydimethylsiloxane(PDMS), polyimide, poly(methyl methacrylate) (PMMA), a ceramic material,an epoxy resin, and a synthetic resin.

FIG. 9 is a sectional view of part of a display apparatus according to aseventh exemplary embodiment of the present invention.

Referring to FIG. 9, the display apparatus 100 according to the seventhexemplary embodiment includes a blue light emitting diode part 102, ared light emitting diode part 104, a green light emitting diode part106, and a circuit board 200.

The blue light emitting diode part 102 includes a substrate 110, a bluelight emitting diode chip 122, a first substrate electrode 132, a secondsubstrate electrode 134, an insulating portion 140, and a connectionelectrode 180.

The substrate 110 supports the blue light emitting diode part 102, andmay include an insulating material and have a predetermined thickness.

As shown in FIG. 9, the blue light emitting diode chip 122 has avertical structure and may include a light emitting structure 29 and ap-type electrode 33. Here, the light emitting structure 29 may includean n-type semiconductor layer 23, an active layer 25, and a p-typesemiconductor layer 27.

The light emitting structure 29 includes a p-type semiconductor layer 27disposed at a lower side thereof, an n-type semiconductor layer 23disposed at an upper surface thereof, and an active layer 25 interposedbetween the p-type semiconductor layer 27 and the n-type semiconductorlayer 23. Although an n-type electrode 31 may be disposed on an uppersurface of the n-type semiconductor layer 23, description of the n-typeelectrode 31 is omitted in this exemplary embodiment. According to thisexemplary embodiment, the light emitting structure 29 may be anAlInGaN-based nitride semiconductor.

The p-type electrode 33 is disposed on a lower surface of the p-typesemiconductor layer 27 and includes first to third electrode portions 33a, 33 b, 33 c. The first electrode portion 33 a electrically contactsthe p-type electrode 33, and the second electrode portion 33 b and thethird electrode portion 33 c are sequentially disposed on a lower sideof the first electrode portion 33 a. In this exemplary embodiment, thefirst electrode portion 33 a may include gold (Au), the second electrodeportion 33 b may include aluminum (Al), and the third electrode portion33 c may include silver (Ag).

Although the p-type electrode 33 according to this exemplary embodimenthas a multilayer structure including the first to third electrodeportions 33 a, 33 b, 33 c, the p-type electrode 33 may have a monolayerstructure, as needed, and the p-type electrode 33 may have a thinnerthickness than that shown in FIG. 9.

In this exemplary embodiment, the light emitting structure 29 isdisposed on the first substrate electrode 132 and the p-type electrode33 of the light emitting structure 29 is electrically connected to thefirst substrate electrode 132. Here, the p-type electrode 33 may becoupled to the first substrate electrode 132 by a bonding portion S.

In addition, the connection electrode 180 is disposed to cover the uppersurface of the n-type semiconductor layer 23. The connection electrode180 electrically connects the n-type semiconductor layer 23 to thesecond substrate electrode 134 and may include a transparent material,for example, ITO or ZnO, to allow light emitted from the blue lightemitting diode chip 122 to pass therethrough.

The first substrate electrode 132 and the second substrate electrode 134are disposed under the blue light emitting diode chip 122 and are spacedapart from each other so as to be electrically insulated from eachother. The first substrate electrode 132 is electrically connected tothe p-type electrode 33 and the second substrate electrode 134 iselectrically connected to the n-type semiconductor layer 23 through theconnection electrode 180.

The insulating portion 140 is disposed to cover the blue light emittingdiode chip 122. The insulating portion 140 serves to protect the bluelight emitting diode chip 122 and the connection electrode 180 fromexternal environments and to prevent electric short due to foreignmatter. In this exemplary embodiment, the insulating portion 140 may beformed of a transparent material or a translucent material to allowlight emitted from the blue light emitting diode chip 122 to bedischarged outside therethrough. For example, the insulating portion 140may include at least one of polydimethylsiloxane (PDMS), polyimide,poly(methyl methacrylate) (PMMA), and a ceramic material.

The red light emitting diode part 104 includes a substrate 110, a bluelight emitting diode chip 122, a first substrate electrode 132, a secondsubstrate electrode 134, a phosphor portion 160, a color filter 170, anda connection electrode 180. In this exemplary embodiment, the substrate110, the blue light emitting diode chip 122, the first substrateelectrode 132 and the second substrate electrode 134 are the same asthose of the blue light emitting diode part 102 according to the thirdexemplary embodiment.

As in the insulating portion 140 of the blue light emitting diode part102, the phosphor portion 160 may be disposed to cover the blue lightemitting diode chip 122, the connection electrode 180 and an uppersurface of the substrate 110. The phosphor portion 160 may contain atleast one type of phosphor. Specifically, the phosphor portion 160 maycontain a phosphor capable of emitting red light through wavelengthconversion of blue light emitted from the blue light emitting diode chip122.

Although the red light emitting diode part 104 includes the blue lightemitting diode chip 122 in this exemplary embodiment, the red lightemitting diode part 104 may include a UV light emitting diode chip, asneeded. In the structure wherein the red light emitting diode part 104includes the UV light emitting diode chip, the phosphor portion 160 maycontain a phosphor capable of emitting red light through wavelengthconversion of UV light emitted from the UV light emitting diode chip122.

According to this exemplary embodiment, the phosphor portion 160 mayinclude at least one type of phosphor together with at least one ofpolydimethylsiloxane (PDMS), polyimide, poly(methyl methacrylate)(PMMA), and a ceramic material, which are transparent or translucentmaterials.

The color filter 170 may be disposed to cover upper and side surfaces ofthe phosphor portion 160 and the side surface of the substrate 110. Thecolor filter 170 serves to block light in a predetermined range ofwavelengths among light emitted through the phosphor portion 160. Inthis exemplary embodiment, the color filter 170 blocks blue lightemitted from the blue light emitting diode chip 122 while allowing redlight emitted from the phosphor portion 160 through wavelengthconversion to pass therethrough. Accordingly, the color filter 170 canminimize discharge of blue light from the light emitting diode package.That is, the color filter 170 is provided to the light emitting diodepackage in order to maximize the ratio of light subjected to wavelengthconversion by the phosphor portion 160 to light emitted through thecolor filter 170.

The color filter 170 may have as small a thickness as possible on theupper and side surfaces of the phosphor portion 160 while blocking asmuch blue light emitted from the blue light emitting diode chip 122 aspossible.

In the structure wherein the red light emitting diode part 104 includesthe UV light emitting diode chip instead of the blue light emittingdiode chip 122, the color filter 170 may block UV light emitted from theUV light emitting diode chip. As a result, the color filter can minimizedischarge of UV light from the light emitting diode package.

The green light emitting diode part 106 includes a substrate 110, agreen light emitting diode chip 126, a first substrate electrode 132, asecond substrate electrode 134, and a connection electrode 180.

The green light emitting diode chip 126 includes a light emittingstructure 29 and a p-type electrode 33, in which the light emittingstructure 29 includes an n-type semiconductor layer 23, an active layer25, and a p-type semiconductor layer 27. The light emitting structure 29of the green light emitting diode chip 126 may be formed of anAlInGaN-based nitride semiconductor and the composition of the activelayer 25 may be determined such that the green light emitting diode chip126 can emit light having a peak wavelength in the green wavelengthband.

In this exemplary embodiment, the green light emitting diode part 106has the same structure as the blue light emitting diode part 102 exceptfor the use of the green light emitting diode chip 126, and thusdetailed description thereof will be omitted.

The blue light emitting diode part 102, the red light emitting diodepart 104 and the green light emitting diode part 106 are arranged on anupper surface of the circuit board 200. The circuit board 200 accordingto this exemplary embodiment may be the same as the circuit boardaccording to the third exemplary embodiment.

FIG. 10 is a sectional view of part of a display apparatus according toan eighth exemplary embodiment of the present invention.

Referring to FIG. 10, the display apparatus 100 according to the eighthexemplary embodiment includes a blue light emitting diode part 102, ared light emitting diode part 104, a green light emitting diode part106, and a coupling structure 210.

The blue light emitting diode part 102 includes a substrate 110, a bluelight emitting diode chip 122, a first substrate electrode 132, a secondsubstrate electrode 134, and a connection electrode 180. The red lightemitting diode part 104 includes a substrate 110, a blue light emittingdiode chip 122, a first substrate electrode 132, a second substrateelectrode 134, a phosphor portion 160, a color filter 170, and aconnection electrode 180. The green light emitting diode part 106includes a substrate 110, a green light emitting diode chip 126, a firstsubstrate electrode 132, a second substrate electrode 134, and aconnection electrode 180.

According to this exemplary embodiment, the blue light emitting diodepart 102 and the green light emitting diode part 106 are the same asthose of the display apparatus according to the fifth exemplaryembodiment except for the insulating portion 140, and thus detaileddescription thereof will be omitted. The red light emitting diode part104 according to this exemplary embodiment is the same as that of thedisplay apparatus according to third exemplary embodiment, and detaileddescription thereof will be omitted.

The blue light emitting diode part 102, the red light emitting diodepart 104 and the green light emitting diode part 106 are spaced apartfrom one another, and the coupling structure 210 is disposed to coverall of the blue light emitting diode part 102, the red light emittingdiode part 104 and the green light emitting diode part 106.

The coupling structure 210 fills spaces between the blue light emittingdiode part 102, the red light emitting diode part 104 and the greenlight emitting diode part 106, and couples the blue light emitting diodepart 102, the red light emitting diode part 104 and the green lightemitting diode part 106 to form an integrated structure.

According to this embodiment, the coupling structure 210 may be formedof a transparent material or a translucent material, like the insulatingportion 140 of the third exemplary embodiment. For example, the couplingstructure 210 may include at least one of polydimethylsiloxane (PDMS),polyimide, poly(methyl methacrylate) (PMMA), a ceramic material, anepoxy resin, and a synthetic resin.

FIG. 11 is a sectional view of part of a display apparatus according toa ninth exemplary embodiment of the present invention.

Referring to FIG. 11, the display apparatus 100 according to the ninthexemplary embodiment includes a blue light emitting diode part 102, ared light emitting diode part 104, a green light emitting diode part106, and a coupling structure 210.

The blue light emitting diode part 102 and the green light emittingdiode part 106 are the same as those of the eighth exemplary embodiment,and detailed description thereof will be omitted.

The red light emitting diode part 104 includes a substrate 110, a redlight emitting diode chip 124, a first substrate electrode 132, a secondsubstrate electrode 134, and a connection electrode 180. As in the bluelight emitting diode part 102, the first substrate electrode 132 and thesecond substrate electrode 134 according to this exemplary embodimentare coupled to the substrate 110, and the red light emitting diode chip124 is electrically coupled to the first substrate electrode 132 and thesecond substrate electrode 134.

The red light emitting diode chip 124 includes a light emittingstructure 29 and a p-type electrode 33, in which the light emittingstructure 29 includes an n-type electrode 31, an active layer 25 and ap-type electrode 33. The light emitting structure 29 of the red lightemitting diode chip 124 may be formed of an AlInGaP-based nitridesemiconductor and the composition of the active layer 25 may bedetermined such that the red light emitting diode chip 124 can emitlight having a peak wavelength in the red wavelength band.

With the blue light emitting diode part 102, the red light emittingdiode part 104 and the green light emitting diode part 106 arranged asshown in FIG. 11, the coupling structure 210 is disposed to cover theblue light emitting diode part 102, the red light emitting diode part104 and the green light emitting diode part 106. As in the eighthexemplary embodiment, the coupling structure 210 fills spaces betweenthe blue light emitting diode part 102, the red light emitting diodepart 104 and the green light emitting diode part 106, and couples theblue light emitting diode part 102, the red light emitting diode part104 and the green light emitting diode part 106 to form an integratedstructure.

According to this exemplary embodiment, the coupling structure 210 maybe formed of a transparent material or a translucent material. Forexample, the coupling structure 210 may include at least one ofpolydimethylsiloxane (PDMS), polyimide, poly(methyl methacrylate)(PMMA), a ceramic material, an epoxy resin, and a synthetic resin.

FIG. 12 is a sectional view of a light emitting diode package accordingto a tenth exemplary embodiment of the present invention.

Referring to FIG. 12, a light emitting diode part 100 a according to thetenth exemplary embodiment includes a substrate 110, a light emittingdiode chip 120, a first substrate electrode 132, a second substrateelectrode 134, and an insulating portion 140.

The substrate 110 supports the light emitting diode part 100 a and thelight emitting diode chip 120. In this exemplary embodiment, thesubstrate 110 may be formed of an insulating material and have apredetermined thickness.

The light emitting diode chip 120 is disposed on the substrate 110 andmay emit light upon receiving power from an external power source. Asshown in FIG. 12, the light emitting diode chip 120 may include a lightemitting structure 29, an n-type electrode 31, a p-type electrode 33, ann-type bump 35, a p-type bump 37, and an encapsulation portion 39. Thelight emitting structure 29 may include an n-type semiconductor layer23, an active layer 25, and a p-type semiconductor layer 27.

Each of the n-type semiconductor layer 23, the active layer 25 and thep-type semiconductor layer 27 may include Group III-V based compoundsemiconductors. By way of example, each of the n-type semiconductorlayer 23, the active layer 25 and the p-type semiconductor layer 27 mayinclude nitride semiconductors such as (Al, Ga, In)N. The n-typesemiconductor layer 23 may be interchangeably placed with the p-typesemiconductor layer 27.

The n-type semiconductor layer 23 may be a conductive semiconductorlayer containing n-type dopants (for example, Si), and the p-typesemiconductor layer 27 may be a conductive semiconductor layercontaining p-type dopants (for example, Mg). The active layer 25 isinterposed between the n-type semiconductor layer 23 and the p-typesemiconductor layer 27, and may include a multi-quantum well (MQW)structure. The composition of the active layer 25 may be determined toemit light having a desired peak wavelength.

In this exemplary embodiment, the light emitting diode chip 120 may emitblue light or green light. In this case, the light emitting structure 29may be an AlInGaN-based nitride semiconductor. Alternatively, the lightemitting structure 29 may emit red light. In this case, the lightemitting structure 29 may be an AlGaInP-based nitride semiconductor.

Referring to FIG. 12, in the light emitting structure 29 according tothis exemplary embodiment, the active layer 25 and the n-typesemiconductor layer 23 are sequentially disposed on the p-typesemiconductor layer 27 in the stated order. In addition, a portion ofthe n-type semiconductor layer 23 may be exposed by partially removingthe p-type semiconductor layer 27 and the active layer 25.

The p-type electrode 33 is disposed on a lower surface of the p-typesemiconductor layer 27 to be electrically connected to the p-typesemiconductor layer 27, and the n-type electrode 31 is disposed on theexposed portion of the n-type semiconductor layer 23 to be electricallyconnected to the n-type semiconductor layer 23. That is, in thisexemplary embodiment, the light emitting diode chip 120 may be ahorizontal type light emitting diode chip 120 in which the n-typeelectrode 31 and the p-type electrode 33 are arranged in the samedirection.

The encapsulation portion 39 may be disposed on the lower surface of thelight emitting structure 29 to cover the n-type electrode 31, the p-typeelectrode 33 and the light emitting structure 29. The encapsulationportion 39 exhibits electrically insulating properties and can protectthe light emitting structure 29, the n-type electrode 31 and the p-typeelectrode 33 from external environments. In this exemplary embodiment,the encapsulation portion 39 may be formed of a transparent material.Alternatively, the encapsulation portion 39 may be formed of an opaquematerial or a translucent material, as needed. Here, the encapsulationportion 39 may have the same width as the light emitting structure 29.

Each of the n-type bump 35 and the p-type bump 37 may be disposed tocover a portion of a lower surface of the encapsulation portion 39. Inaddition, the n-type bump 35 may be electrically connected to the n-typeelectrode 31 and the p-type bump 37 may be electrically connected to thep-type electrode 33 through via-holes formed in the encapsulationportion 39. The n-type bump 35 and the p-type bump 37 are spaced apartfrom each other on the lower surface of the encapsulation portion 39 tobe electrically insulated from each other.

The first substrate electrode 132 and the second substrate electrode 134are provided to the substrate 110. The first substrate electrode 132extends from an upper surface of the substrate 110 to a lower surfacethereof through the substrate 110. That is, a portion of the firstsubstrate electrode 132 is disposed on the upper surface of thesubstrate 110 and another portion of the first substrate electrode 132is disposed on the lower surface of the substrate 110 such that bothportions of the first substrate electrode 132 are electrically connectedto each other through a via-hole formed in the substrate 110. Like thefirst substrate electrode 132, portions of the second substrateelectrode 134 are disposed on the upper and lower surfaces of thesubstrate 110, respectively, and are electrically connected to eachother through a via-hole formed in the substrate 110. In this exemplaryembodiment, the first substrate electrode 132 may be spaced apart fromthe second substrate electrode 134 to be electrically insulated fromeach other.

The portions of the first substrate electrode 132 and the secondsubstrate electrode 134 disposed on the upper surface of the substrate110 may be electrically connected to the n-type bump 35 and the p-typebump 37 of the light emitting diode chip 120, and may be bonded theretoby a bonding portion S. That is, the light emitting diode chip 120 isdisposed on the substrate 110 such that the n-type bump 35 and thep-type bump 37 disposed on the lower surface of the light emitting diodechip 120 are electrically connected to the first substrate electrode 132and the second substrate electrode 134, respectively.

The insulating portion 140 may be disposed to cover the light emittingdiode chip 120 and the upper surface of the substrate 110. Theinsulating portion 140 serves to protect the light emitting structure 29of the light emitting diode chip 120 from external environments and toprevent electric short due to foreign matter. In this exemplaryembodiment, the insulating portion 140 may be formed of a transparentmaterial or a translucent material to allow light emitted from the lightemitting diode chip 120 to be discharged outside therethrough. Forexample, the insulating portion 140 may include at least one ofpolydimethylsiloxane (PDMS), polyimide, poly(methyl methacrylate)(PMMA), and a ceramic material.

In this exemplary embodiment, since the light emitting diode chip 120has a predetermined width L1 or less, the light emitting diode chip 120is used in a state of being mounted on the substrate 110. For example,the light emitting diode chip 120 may have a width L1 of 200 μm or less,specifically 50 μm or less, or 10 μm or less.

In the related art, since light emitting diode chips 120 having a smallwidth L1 are used, it is not easy to mount each of the light emittingdiode chips 120 on a printed circuit board and to replace the lightemitting diode chip 120 mounted on the printed circuit board due tofailure of the light emitting diode chip 120. According to thisexemplary embodiment, the light emitting diode part 100 a may have awidth L2 of 150 μm or more, which is the minimum width for amanufacturing process thereof, preferably greater than 200 μm.Accordingly, the light emitting diode part 100a can be relatively largewhile reducing the luminous area of the light emitting diode part 100 a.

Furthermore, the size of the light emitting diode chip 120 can bereduced while reducing the luminous area of the light emitting diodepart 100 a, thereby reducing manufacturing costs of the light emittingdiode part 100 a.

FIG. 13 is a sectional view of a light emitting diode package accordingto an eleventh exemplary embodiment of the present invention.

Referring to FIG. 13, a light emitting diode part 100 a according to theeleventh exemplary embodiment includes a substrate 110, a light emittingdiode chip 120, a first substrate electrode 132, a second substrateelectrode 134, an insulating portion 140, and a reflective portion 150.Descriptions of the same components as the tenth exemplary embodimentwill be omitted herein.

In this exemplary embodiment, the substrate 110, the light emittingdiode chip 120, the first substrate electrode 132, the second substrateelectrode 134, and the insulating portion 140 are the same as those ofthe light emitting diode package according to the tenth exemplaryembodiment.

The reflective portion 150 is disposed to surround side surfaces of thesubstrate 110 and the insulating portion 140. The reflective portion 150serves to reflect light traveling in a lateral direction of the lightemitting diode package when the light emitted from the light emittingdiode chip 120 is discharged through the insulating portion 140. Thus,the reflective portion 150 may include an opaque material having highreflectivity while providing less light loss. In addition, thereflective portion 150 may be coated with a high reflectivity (HR)material, as needed. Here, the HR material may be silver (Ag) or astacked layer of TiO2/SiO2.

When light emitted from the light emitting diode chip 120 is dischargedthrough side surfaces of plural light emitting diode packages 100mounted on a printed circuit board, there can be a disturbance inmixture of different colors emitted from the light emitting diodepackages 100.

That is, in a structure wherein a blue light emitting diode part 100 a,a red light emitting diode part 100 a and a green light emitting diodepart 100 a are mounted on the printed circuit board, white light can berealized through mixture of light emitted from these light emittingdiode packages 100. Here, when light is emitted from the side surfacesof the light emitting diode packages 100, uneven mixing of the lightemitted from the light emitting diode packages 100 occurs, therebycausing deterioration in color reproduction.

According to this exemplary embodiment, the reflective portion 150 isdisposed to surround the side surfaces of the substrate 110 and theinsulating portion 140 to reflect light emitted from the light emittingdiode part 100 a in an upward direction.

FIG. 14 is a sectional view of a light emitting diode package accordingto a twelfth exemplary embodiment of the present invention.

Referring to FIG. 14, a light emitting diode part 100 a according to thetwelfth exemplary embodiment includes a substrate 110, a light emittingdiode chip 120, a first substrate electrode 132, a second substrateelectrode 134, a phosphor portion 160, and a color filter 170.

In this exemplary embodiment, the substrate 110, the light emittingdiode chip 120, the first substrate electrode 132, and the secondsubstrate electrode 134 are the same as those of the light emittingdiode package according to the tenth exemplary embodiment, and thusdescriptions thereof will be omitted herein

The phosphor portion 160 may be disposed to cover the light emittingdiode chip 120 and an upper surface of the substrate 110. The phosphorportion 160 may contain at least one type of phosphor. In this exemplaryembodiment, the light emitting diode chip 120 may be a blue or UV lightemitting diode chip.

Accordingly, the phosphor portion 160 may emit red light or green lightthrough wavelength conversion of blue or UV light emitted from a bluelight emitting diode chip or a UV light emitting diode chip. In order toallow the phosphor portion 160 to emit red light, the phosphor portion160 may contain a phosphor capable of emitting red light throughwavelength conversion of blue light or UV light. In order to allow thephosphor portion 160 to emit green light, the phosphor portion 160 maycontain a phosphor capable of emitting green light through wavelengthconversion of blue light or UV light.

According to this exemplary embodiment, the phosphor portion 160 mayinclude at least one type of phosphor together with a transparentmaterial or a translucent material, which includes at least one ofpolydimethylsiloxane (PDMS), polyimide, poly(methyl methacrylate)(PMMA), and a ceramic material, as in the insulating portion 140 of thelight emitting diode package according to the tenth exemplaryembodiment.

The color filter 170 may be disposed to cover the phosphor portion 160and the side surface of the substrate 110. As shown in FIG. 3, the colorfilter 170 covers upper and side surfaces of the phosphor portion 160while covering the side surface of the substrate 110. The color filter170 serves to block blue light or UV light emitted from the lightemitting diode chip 120. Accordingly, the color filter 170 can minimizedischarge of blue light or UV light from the light emitting diodepackage by blocking the blue light or the UV light emitted through thephosphor portion 160. That is, the color filter 170 is provided to thelight emitting diode package in order to maximize the ratio of lightsubjected to wavelength conversion by the phosphor portion 160 to lightemitted through the color filter 170.

FIG. 15 is a sectional view of a light emitting diode package accordingto a thirteenth exemplary embodiment of the present invention.

Referring to FIG. 15, a light emitting diode part 100 a according to thethirteenth exemplary embodiment includes a substrate 110, a lightemitting diode chip 120, a first substrate electrode 132, a secondsubstrate electrode 134, a phosphor portion 160, a color filter 170, anda reflective portion 150.

In this exemplary embodiment, the substrate 110, the light emittingdiode chip 120, the first substrate electrode 132, the second substrateelectrode 134, the phosphor portion 160, and the color filter 170 arethe same as those of the light emitting diode package according to thetwelfth exemplary embodiment and thus descriptions thereof will beomitted herein.

The reflective portion 150 is disposed to surround a side surface of thecolor filter 170. The reflective portion 150 serves to reflect lighttraveling in a lateral direction of the light emitting diode packagewhen the light emitted from the light emitting diode chip 120 isdischarged through the phosphor portion 160 and the color filter 170.Thus, as in the eleventh exemplary embodiment, the reflective portion150 may include an opaque material having high reflectivity whileproviding less light loss. In addition, the reflective portion 150 maybe coated with a high reflectivity (HR) material, as needed.

FIG. 16 is a sectional view of a light emitting diode package accordingto a fourteenth exemplary embodiment of the present invention.

Referring to FIG. 16, a light emitting diode part 100 a according to thefourteenth exemplary embodiment includes a substrate 110, a lightemitting diode chip 120, a first substrate electrode 132, a secondsubstrate electrode 134, an insulating portion 140, and a connectionelectrode 180.

In this exemplary embodiment, the substrate 110, the first substrateelectrode 132 and the second substrate electrode 134 are the same asthose of the light emitting diode package according to the tenthexemplary embodiment. In this exemplary embodiment, the substrate 110may have a smaller size than the substrate of the tenth exemplaryembodiment, and the distance between the first substrate electrode 132and the second substrate electrode 134 may be smaller than that of thetenth exemplary embodiment. In addition, although the first substrateelectrode 132 and the second substrate electrode 134 may not be disposedon the upper surface of the substrate 110, the first substrate electrode132 and the second substrate electrode 134 may be exposed to the uppersurface of the substrate 110, as needed.

The light emitting diode chip 120 may be disposed on the first substrateelectrode 132 to be electrically connected to the first substrateelectrode 132. Referring to FIG. 5, the light emitting diode chip 120includes a light emitting structure 29, an n-type electrode 31 and ap-type electrode 33. In this exemplary embodiment, the light emittingstructure 29 may include an n-type semiconductor layer 23, an activelayer 25, and a p-type semiconductor layer 27.

In this exemplary embodiment, the light emitting diode chip 120 may be avertical type light emitting diode chip in which the active layer 25 andthe p-type semiconductor layer 27 are sequentially stacked on the n-typesemiconductor layer 23 in the stated order. Here, the n-typesemiconductor layer 23 may be interchangeable with the p-typesemiconductor layer 27.

The n-type electrode 31 may be disposed on a lower surface of the n-typesemiconductor layer 23 and the p-type electrode 33 may be disposed on anupper surface of the p-type semiconductor layer 27. The n-type electrode31 electrically connects the first substrate electrode 132 to the n-typesemiconductor layer 23. The p-type electrode 33 is disposed on an uppersurface of the p-type semiconductor layer 27 and may include atransparent material. Although not shown in the drawings, the n-typeelectrode 31 may be coupled to the first substrate electrode 132 via abonding portion S.

The connection electrode 180 may be disposed to cover the p-typeelectrode 33 and extend to be electrically connected to the secondsubstrate electrode 134. That is, the connection electrode 180electrically connects the p-type electrode 33 to the second substrateelectrode 134. Thus, as shown in FIG. 5, the connection electrode 180covers the p-type electrode 33, extends in one direction, is bent toextend downwards, and is bent and extends in one direction to beelectrically connected to the second substrate electrode 134.

The connection electrode 180 may include a transparent material such asindium tin oxide (ITO) or ZnO to allow light emitted from the lightemitting diode chip 120 to pass therethrough. Here, some portions of theconnection electrode 180 may be formed of a transparent material and aportion of the connection electrode 180 contacting the second substrateelectrode 134 may include an opaque material. The connection electrode180 may be coupled to the second substrate electrode 134 via a bondingportion S.

The insulating portion 140 may be disposed to cover the light emittingdiode chip 120 and an upper surface of the substrate 110. The insulatingportion 140 serves to protect the light emitting structure 29 of thelight emitting diode chip 120 and the connection electrode 180 fromexternal environments. Accordingly, the insulating portion 140 may bedisposed to cover upper and side surfaces of the light emitting diodechip 120 while covering the entirety of the connection electrode 180such that the connection electrode 180 cannot be exposed outside by theinsulating portion 140. As in the tenth exemplary embodiment, theinsulating portion 140 may include at least one of polydimethylsiloxane(PDMS), polyimide, poly(methyl methacrylate) (PMMA), and a ceramicmaterial.

In this exemplary embodiment, the insulating portion 140 may contain atleast one type of phosphor. Here, the insulating portion 140 may act asthe phosphor portion 160 of the twelfth exemplary embodiment. In thestructure wherein the insulating portion 140 contains at least one typeof phosphor, the light emitting diode part 100 a according to thisexemplary embodiment may further include the color filter 170 asdescribed in the twelfth exemplary embodiment.

In this exemplary embodiment, the light emitting diode chip 120 may havea width L3 of 50 μm or less, or 10 μm or less. The light emitting diodepart 100 a may have a width L4 of 150 μm or more (preferably greaterthan 200 μm).

FIG. 17 is a sectional view of a light emitting diode package accordingto a fifteenth exemplary embodiment of the present invention.

Referring to FIG. 17, a light emitting diode part 100 a according to thefifteenth exemplary embodiment includes a substrate 110, a lightemitting diode chip 120, a first substrate electrode 132, a secondsubstrate electrode 134, an insulating portion 140, a reflective portion150, and a connection electrode 180.

In this exemplary embodiment, the substrate 110, the first substrateelectrode 132, the second substrate electrode 134, the insulatingportion 140, and the connection electrode 180 are the same as those ofthe light emitting diode package according to the fourteenth exemplaryembodiment, and descriptions thereof will be omitted herein.

The reflective portion 150 is disposed to surround side surfaces of thesubstrate 110 and the insulating portion 140. The reflective portion 150serves to reflect light traveling in the lateral direction of the lightemitting diode package when the light emitted from the light emittingdiode chip 120 is discharged through the insulating portion 140. Thus,as in the eleventh exemplary embodiment, the reflective portion 150 mayinclude an opaque material having high reflectivity while providing lesslight loss. In addition, the reflective portion 150 may be coated with ahigh reflectivity (HR) material, as needed.

Although some exemplary embodiments have been described herein, itshould be understood by those skilled in the art that these embodimentsare given by way of illustration only, and that various modifications,variations, and alterations can be made without departing from thespirit and scope of the present invention. Therefore, the scope of thepresent invention should be limited only by the accompanying claims andequivalents thereof.

What is claimed is:
 1. A display apparatus comprising: a circuit board;and a plurality of pixels disposed on the circuit board, wherein: atleast one of a blue light emitting diode chip, a red light emittingdiode part, and a green light emitting diode chip is disposed in each ofthe pixels; and the blue light emitting diode chip, the red lightemitting diode part, and the green light emitting diode chip are coveredby a coupling structure.
 2. The display apparatus according to claim 1,further comprising: a substrate on which the blue light emitting diodechip, the red light emitting diode part, and the green light emittingdiode chip are disposed; and a plurality of first substrate electrodesand a plurality of second substrate electrodes disposed on the substrateand each electrically connected to each of the blue light emitting diodechip, the red light emitting diode part, and the green light emittingdiode chip, the plurality of first substrate electrodes and theplurality of second substrate electrodes being electrically insulatedfrom each other, wherein the coupling structure is disposed on thesubstrate.
 3. The display apparatus according to claim 1, wherein thered light emitting diode part comprises a red light emitting diode chip.4. The display apparatus according to claim 2, wherein the red lightemitting diode part comprises: a blue light emitting diode chip or a UVlight emitting diode chip disposed on the substrate; an insulatingportion covering the blue light emitting diode chip or the UV lightemitting diode chip and containing at least one type of phosphoremitting red light through wavelength conversion of light emitted fromthe blue light emitting diode chip or the UV light emitting diode chip;and a color filter configured to block blue light or UV light amonglight discharged through the insulating portion.
 5. The displayapparatus according to claim 2, wherein each of the first substrateelectrodes and each of the second substrate electrodes are disposed onupper and lower surfaces of the substrate through via-holes formed inthe substrate.
 6. The display apparatus according to claim 5, whereinthe first substrate electrodes and the second substrate electrodes areelectrically connected to the circuit board.
 7. The display apparatusaccording to claim 2, wherein the circuit board comprises a circuitconfigured to allow the first substrate electrodes to be electricallyconnected as individual electrodes to the blue light emitting diodechip, the red light emitting diode part, and the green light emittingdiode chip, respectively, and to allow the second s substrate electrodesto be electrically connected as common electrodes to the blue lightemitting diode chip, the red light emitting diode part, and the greenlight emitting diode chip, respectively.
 8. The display apparatusaccording to claim 1, further comprising: a reflective portionsurrounding a side surface of the coupling structure and configured toreflect light emitted through the coupling structure.
 9. The displayapparatus according to claim 1, wherein at least one of the blue lightemitting diode chip and the green light emitting diode chip comprises: alight emitting structure comprising a first conductivity typesemiconductor layer, a second conductivity type semiconductor layer, andan active layer interposed between the first and second conductivitytype semiconductor layers; and a first electrode electrically connectedto the first conductivity type semiconductor layer.
 10. The displayapparatus according to claim 9, wherein: at least one of the blue lightemitting diode chip and the green light emitting diode chip furthercomprises a second electrode electrically connected to the secondconductivity type semiconductor layer, the first and second electrodesbeing arranged in one direction of the light emitting structure; and thefirst electrode is electrically connected to an exposed region of thefirst conductivity type semiconductor layer formed by partially removingthe active layer and the second conductivity type semiconductor layer.11. The display apparatus according to claim 10, wherein at least one ofthe blue light emitting diode chip and the green light emitting diodechip further comprises: an encapsulation portion covering the first andsecond electrodes and the light emitting structure while insulating thefirst and second electrodes from each other; a first bump electricallyconnected to the first electrode; and a second bump electricallyconnected to the second electrode, the first and second bumps beingelectrically connected to the first and second electrodes through theencapsulation portion, respectively.
 12. The display apparatus accordingto claim 2, wherein at least one of the blue light emitting diode chipand the green light emitting diode chip has a width less than thesubstrate.
 13. The display apparatus according to claim 1, wherein thecoupling structure comprises at least one of polydimethylsiloxane(PDMS), polyimide, poly(methyl methacrylate) (PMMA), a ceramic material,an epoxy resin, and a synthetic resin.
 14. A method of manufacturing adisplay apparatus, comprising: forming a plurality of light emittingdiode chips on a first manufacturing substrate; coupling at least someof the light emitting diode chips to a substrate comprising first andsecond substrate electrodes and provided to a second manufacturingsubstrate, followed by removing the first manufacturing substrate;forming an insulating portion to cover the plurality of light emittingdiode chips; coupling a third manufacturing substrate to an uppersurface of the insulating portion, followed by removing the secondmanufacturing substrate; forming a plurality of light emitting diodepackages by removing the insulating portion with reference to theplurality of light emitting diode chips; and transferring some of thelight emitting diode packages from the third manufacturing substrate toa printed circuit board.
 15. The method of manufacturing a displayapparatus according to claim 14, wherein forming the plurality of lightemitting diode chips comprises: forming a plurality of light emittingstructures on the first manufacturing substrate, each of the lightemitting structures comprising a first conductivity type semiconductorlayer, a second conductivity type semiconductor layer, and an activelayer interposed between the first and second conductivity typesemiconductor layers; forming an encapsulation portion to cover theplurality of light emitting structures and forming first and secondbumps on the encapsulation portion to be electrically connected to thefirst and second conductivity type semiconductor layers, respectively;forming a first manufacturing insulating portion to cover theencapsulation portion and the first and second bumps; and exposing thefirst and second bumps through the encapsulation portion, whereincoupling at least some of the light emitting diode chips to thesubstrate comprises electrically coupling the first and second bumps tothe first and second substrate electrodes, respectively.
 16. The methodof manufacturing a display apparatus according to claim 15, wherein: thefirst and second conductivity type semiconductor layers are exposed inone direction; first and second electrodes are formed on the first andsecond conductivity type semiconductor layers, respectively; and thefirst and second bumps are electrically connected to the first andsecond electrodes through the encapsulation portion, respectively. 17.The method of manufacturing a display apparatus according to claim 14,wherein, in coupling the third manufacturing substrate to the uppersurface of the insulating portion, at least one buffer layer is formedbetween the insulating portion and the third manufacturing substrate.18. The method of manufacturing a display apparatus according to claim14, wherein the insulating portion comprises at least one ofpolydimethylsiloxane (PDMS), polyimide, poly(methyl methacrylate)(PMMA), and a ceramic material.